Glass Fabrication Services-Scratch-Glass Wafer Fabrication (Borosilicate & Quartz)
At YIHAI Glass, we’ve honed our glass design and production capabilities for more than 80 years. Using the latest innovations in glass manufacturing technology, we can fabricate a wide range of high quality standard or custom-designed glass wafers to suit the needs of many applications.
When you bring your glass wafer production project to YIHAI Glass, you’ll gain access to the highest quality materials, the most advanced cutting tools and finishing machines, and one of the most experienced teams in the industry.
Glass Wafer Applications & Industries
wafers-pageGlass wafers are used in a wide variety of technical and industrial applications. Some of these applications include:
Microelectromechanical systems (MEMS) and Electronics
In MEMS applications, glass wafers are often used as a substrate carrier in the fabrication process for thinner silicon wafers. MEMS components such as silicon wafers have broad applications in micro sensor, electronics, and computer manufacturing.
Semiconductors
Glass wafer and silica wafer usage in semiconductor manufacturing varies based on design. Glass wafers may be used as a permanent substrate which remains in the final product or as a temporary substrate for smaller or thinner materials.
Biotechnology
Scientists and researchers increasingly use glass wafers to fabricate microfluidic chips. Borosilicate chips can be particularly useful for these applications because of their affordability and high chemical resistance.
Integrated circuit (IC) packaging
Rather than cut individual circuits out of glass substrate, some manufacturers now leave them embedded within the wafer for protection. Durable wafer-level packaged ICs are becoming more common in portable electronics such as tablets and smart phones.
Our Glass Wafer Fabrication Process
Glass wafer fabrication is a highly intricate process that requires specialized equipment and manufacturing procedures. To that end, our team of experts uses the most advanced technology available to create wafers that meet precise design standards. Our wafer fabrication process consists of several steps:
Material Selection: We’ll work with you to determine the correct material for your design and use the most consistent sheet of glass available to cut flawless wafers.
Shaping: Once the selected material is cut with our advanced waterjet glass cutting tools, each wafer is ground into an approximate wafer shape.
Edging/Detailing: Our glass wafer fabrication process uses carefully calibrated CNC diamond machine tools, and each wafer is delicately machined to design specifications.
Lapping and Polishing: We use a free abrasive lapping process to develop appropriate surface smoothness before polishing each wafer on both sides.
Inspecting: Wafers undergo a high-precision laser inspection in a cleanroom to ensure that they fall within total thickness verification (TTV) standards.
Materials Used in the Glass Wafer Fabrication Process
YIHAI Glass begins our glass wafer fabrication process with only the highest quality glass materials. Which type of material we use depends on the requirements of the particular design.
